Research
- -3D interconnected nanoelectronic system design and experimental evaluation for high-performance computing
- -Exploratory cooling technologies for dense 3D integrated nanoelectronic systems
- -Silicon nanophotonic interconnect integration and packaging for 2D and 3D electronic systems
- -Multifunction silicon interposer technologies
- -Dense range-of-motion mechanically flexible interconnects for heterogeneous system integration
- -3D integrated biosensors and electronics