News

October 2019

Sreejith received IEEE 3DIC Best Student Award

September 2019

Dr. Bakir has been appointed as the Dan Fielder Professor, effective September 1, 2019.

September 2019

Carl Li received ASCENT Review Best Poster Award.

February 2019

"Handbook of 3D Integration" is published.

August 2018

McKnight Foundation Technological Innovations in Neuroscience Award made for GT and Emory Collaboration.

June 2018

Muneeb Zia is the first author on a paper that has been named as one of the five most popular papers from the IEEE Transactions on Components, Packaging, and Manufacturing Technology 2017.

March 2018

Dr. Bakir has been named the recipient of the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award

March 2018

Tom has been named the recipient of the 2017 Best Paper Award for the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT)

February 2018

Reza's paper is featured as one of the highlights for 2017 in the Journal of Micromechanics and Microengineering (JMM)

November 2017

Dr. Bakir appointed as Editor-in-Chief for IEEE CPMT journal

February 2017

Dr. Bakir received the 2016 Class of Course Survey Teaching Effectiveness Award

January 2017

Hanju and Xuchen received Best Oral Session Paper Award at ECTC

Nov 2016

Reza received Outstanding Abstract Achievement Award at American Society of Hematology

September 2016

Will received Best in Session Award at SRC TECHCON

May 2016

Reza received Best Poster Award at Annual User Science and Engineering Review from The Institute for Electronics and Nanotechnology (IEN)

April 2016

Joe Gonzalez awarded Goizueta Foundation Fellowship

March 2016

Muneeb Zia and Paul Jo received Best Team Award in NSF I-Corps in 2016 Winter Cohort

February 2016

Joe Gonzalez awarded GEM Fellowship

December 2015

Muneeb Zia and Paul Jo won NSF I-Corps Grant for 2016 Winter Cohort

November 2015

Microfluidic cooled FPGA featured in IEEE Spectrum.

November 2015

Reza Abbaspour won best student paper award at GIT 2015

October 2015

Microfluidic cooled FPGA featured in Georgia Tech news.

June 2015

M. Bakir was appointed as IEEE CPMT distinguished lecturer.

March 2015

James Yang and Chaoqi Zhang received the 2014 Best TCPMT journal paper award for Advanced Packaging.

 

Press Coverage

Press Coverage

  1. Staff, “Making the connection,” The Economist (Print Edition), Jun. 2002.

    • An entire article describing our Sea-of-Leads chip I/O interconnects

  2. “ECTC Technology Flows,” IEEE CPMT Newsletter, Jun. 2002, http://ewh.ieee.org/soc/cpmt/newsletter/200206/cpmtnsltr-0206.pdf

    • Article describing our Sea-of-Leads chip I/O interconnects based on the ECTC 2002 paper (Best Conference Paper Award).

  3. R. Wilson, “Session examines novel semiconductor devices,” EETimes, Feb. 12, 2003. http://www.eetimes.com/conf/isscc/showArticle.jhtml?articleID=18308034&kc=3681

    • Article describing our novel electrical and optical chip I/Os based on the ISSCC 2003 paper.

  4. R. Ball, “Polymer pillars can connect electrical and optical signals,” Electronics Weekly, Feb. 12, 2003 http://www.electronicsweekly.com/Articles/2003/02/12/28404/polymer-pillars-can-connect-electrical-and-optical-signals.htm

    • An entire article describing our novel electrical and optical chip I/Os based on the ISSCC 2003 paper. The article also features figures from the paper.

  5. Staff, “ISSCC: polymer pillars used to connect die,” Electronics Weekly, Feb. 13, 2003. http://www.electronicsweekly.com/Articles/2003/02/13/28415/isscc-polymer-pillars-used-to-connect-die.htm

    • An entire article describing our novel electrical and optical chip I/Os based on the ISSCC 2003 paper.

  6. W. Wayt Gibbs, “Computing at the Speed of Light,” Scientific American, Nov. 2004. http://www.sciam.com/article.cfm?id=computing-at-the-speed-of

    • Article describing our novel electrical and optical chip I/Os based on the IEEE TED 2003 paper. A two-page figure was devoted to illustrate our technology in the magazine.

  7. J. Baliga, “Polymer pillars for optical and electrical signals,” Semiconductor International, Dec. 1, 2004. http://www.semiconductor.net/article/CA483650.html?q=%22polymer+pillars%22

    • An entire article describing our novel electrical and optical chip I/Os based on the ECTC 2004 paper.

  8. R. Colin Johnson, “Water-filled wafers streamline chip cooling,” EETimes, Jul. 4, 2005. http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=165600142

    • An entire article describing our novel on-chip microfluidic interconnects based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  9. staff, “Cooling,” EETimes Asia, Jul. 8, 2005. http://www.eetasia.com/ART_8800371156_499495_NP_82f06612.HTM

    • An entire article reporting our novel cooling technology.

  10. S. Bush, “Fluid cooling plugs direct onto CMOS,” Electronics Weekly, Jul. 20, 2005. http://www.electronicsweekly.com/Articles/2005/07/20/35869/fluid-cooling-plugs-direct-onto-cmos.htm

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  11. staff, “Liquid cooling with microfluidic channels helps computer processors beat the heat,” PhysOrg.com, June 21, 2005. http://www.physorg.com/news4657.html

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  12. R. Colin Johnson, “Water-filled wafers streamline chip cooling,” EETimes Asia, Aug. 16, 2005 http://www.eetasia.com/ART_8800374234_480100_NT_205871dd.HTM

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  13. R. Allan, “Beat the heat with on-chip microfluidics,” Electronic Design, Oct. 13, 2005. http://electronicdesign.com/Articles/Print.cfm?AD=1&ArticleID=11178

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the  IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  14. Staff, “Sematech 3-D IC Workshop Considers Thermal, Design Issues,” Semiconductor International, Sept. 24, 2007 http://www.semiconductor.net/article/CA6481192.html

    • An article reporting our novel 3D integration and cooling technology based on the SEMATECH 2007 paper (invited).

  15. Staff, “Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips,” Nanowerk Business News, Sept. 25, 2007. http://www.nanowerk.com/news/newsid=2695.php

    • An article reporting our novel 3D integration and cooling technology based on the SEMATECH 2007 paper (invited).

  16. B. Haavind, “Moore's Law to head z-ward?,” Solid-State Technology, Oct. 2007. http://www.solid-state.com/display_article/310451/5/ARTCL/none/none/1/Moore's-Law-to-head-z-ward?/

    • An article reporting our novel 3D integration and cooling technology based on the SEMATECH 2007 paper (invited).

  17. R. Wilson, “Session examines novel semiconductor devices Tera-Level Nanodevices,” Nanotech, Feb. 15, 2003. Korea. www.nanotech.re.kr/pds/nano/Electronics%2520Forum-20030214.hwp+%22muhannad+bakir%22&hl=en&ct=clnk&cd=50&gl=us

    • An entire article describing our novel electrical and optical chip I/Os based on the ISSCC 2003 paper.

  18.  “Integrated microfluidic channels for liquid cooling of IC chips,” GT MiRC NewsLetter, Nov./Dec. 2005. http://atlas2.mirc.gatech.edu/news/nov_dec_newsletter.pdf

    • An entire article describing our novel on-chip microfluidic interconnects based on the IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  19. M. LaPedus, “IBM, GIT demo 3D die with microchannel cooling,” EETimes, Jun. 5, 2008. http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=208402305

    • An entire article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper.

  20. A. E. Braun, “IITC gives glimpse of future interconnect,” Semiconductor International, Jun. 2, 2008. http://www.semiconductor.net/article/CA6566002.html?desc=topstory

    • An article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper.

  21. N. Mokhoff, “IITC reports on interconnect progress,” EETimes, May 9, 2008. http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=207601527

    • An article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper.

  22. J. Toon, “Beating the heat: liquid cooling technique uses microfluidic channels integrated onto the backs of chips,” Georgia Tech Research News, June 21, 2005. http://gtresearchnews.gatech.edu/newsrelease/cooling.htm

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  23. S. Henkel, “Microfluidic technology set to chill your chips,” Sensors Magazine, Aug. 1, 2005. http://www.highbeam.com/doc/1G1-155556050.html

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  24. staff, “New Liquid Cooling Technique,” Physics & Astronomy Online, Jun. 26, 2005. http://www.physlink.com/news/062605LiquidCooling.cfm

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  25. Staff, “Liquid cooling with microfluidic channels helps computer processors beat the heat,” Brightsurf Science News, June 21, 2005. http://www.brightsurf.com/news/headlines/20224/Liquid_cooling_with_microfluidic_channels_helps_computer_processors_beat_the_heat.html

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  26. Staff, “Microfluidic channels put liquid cooling on chip,” Power Electronics Technology, Jun. 29, 2005. Entire article. http://powerelectronics.com/news/microfluidic-liquid-cooling/

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  27. R. Comerford, “Chips get tiny channels for carrying liquid coolant,” Electronic Products, Aug. 2005. http://www2.electronicproducts.com/Chips_get_tiny_channels_for_carrying_liquid_coolant-article-olrc01-aug2005-html.aspx

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  28. staff, “Cooling for denser packaging and reliability,” III-V’s Review, Jun. 21, 2005.  http://www.three-fives.com/competitive_complementary_news/June_c_c_news/210605Cool_chip_pack.htm

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award). The article also features figures from the paper.

  29. Staff, “Cooling System Helps Chips Beat Heat,” High Productivity Computing, Jun. 24, 2005. http://www.hpcwire.com/offthewire/17874274.html

    • An entire article describing our novel 3D integration and cooling technology based on the IEEE IITC 2005 paper.

  30. R. Norvell, “Beat the heat: GA Tech researchers find IC liquid cooling technique,” Circuits Assembly, June 24, 2005. http://circuitsassembly.com/cms/content/view/1747/95/

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  31. Staff, “Georgia Tech creates liquid cooling technique for high-density ICs,” Process Cooling, Jan. 18, 2006.  http://www.process-cooling.com/Articles/Industry_News/d7a208c7830e8010VgnVCM100000f932a8c0____

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  32. R. Norvell, “Beating the heat: Georgia Tech researchers find IC liquid cooling technique,” All Business, Aug. 1, 2005. http://www.allbusiness.com/professional-scientific/computer-systems-design/499187-1.html

    • An entire article describing our novel on-chip microfluidic interconnects for cooling based on the IEEE IITC 2005 paper (Best Conference Student Paper Award).

  33. Our research on 3D technology was featured as a main highlight in the 2007 SRC Annual Report, published May 2008.

  34. Our research on 3D technology was featured as one of the highlights from the five Focus Center Programs by DARPA in 2007 (published ~mid-2008).

  35. Staff, “IEEE International Interconnect Technology Conference goes 3D,” Advanced Packaging, May 7, 2008. http://ap.pennnet.com/display_article/327477/36/ARTCL/none/none/1/IEEE-International-Interconnect-Technology-Conference-Goes-3D/

    • An article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper.

  36. A. Braun, “IITC Gives Glimpse of Future Interconnect,” Semiconductor International Magazine, June 2nd, 2008. http://www.semiconductor.net/article/CA6566002.html

    • An entire article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper. The article also features figures from the papers.

  37. M. LaPedus, “IBM, GIT demo 3D die with microchannel cooling,” EETimes, June 5th, 2008. http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=208402305

    • An entire article describing our novel 3D integration and cooling technology based on the IEEE IITC 2008 paper. The article also features figures from the papers.

  38. T. Adams, “Stacked microprocessor system promises better performance” EETimes Asia, Oct. 1st, 2008. http://www.eetasia.com/ART_8800546365_480200_NT_396a8684.HTM

    • An entire article describing our novel 3D integration and cooling technology based on the ECTC 2008 & IEEE IITC 2008 papers. The article also features figures from the papers.

  39. K. Gurnett and T. Adams, “3-D integration begins to define its future” Electronics World, Jan. 2009. http://www.electronicsworld.co.uk/features/111083/FOCUS_-_3-D_integration_begins_to_define_its_future.html

    • An article describing our novel 3D integration and cooling technology based on the ECTC 2008 & IEEE IITC 2008 papers. The article also features figures from the papers.

  40. K. Gurnett and T. Adams, “Up next: silicon-through vias” Military & Aerospace Electronics, to appear mid-2009.

    • An entire article describing our novel 3D integration and cooling technology based on the ECTC 2008 & IEEE IITC 2008 papers. The article also features figures from the papers.

    Sea of Leads Chip I/Os Featured on the Cover the MRS Bulletin (Jan. 2003)

  41. "Liquid Cooling Moves onto the Chip for Denser Electronics" Georgia Tech News, Oct. 5, 2015
    http://www.news.gatech.edu/2015/10/05/liquid-cooling-moves-chip-denser-electronics

  42. "Four New Ways to Chill Computer Chips" IEEE Spectrum, Nov. 20, 2015
    http://spectrum.ieee.org/computing/hardware/four-new-ways-to-chill-computer-chips

 

Moreover, our work on nanoimprint technology was discussed in this article.