Welcome to I3DS Group
End of Fall 2016 group lunch
Microfluidic cooled FPGA
Mechanicaly flexible interconnects
Gold plated mechanically flexible interconnects
High aspect ratio via in silicon
Electrical and microfluidic chip I/Os
Mechanicaly flexible interconnects
Welcome to I3DS group! The multidisciplinary Integrated 3D Systems (I3DS) Research Group at Georgia Tech explores the design, fabrication, and characterization of 3D electronic systems and advanced interconnect networks. Our mission is to explore the limits and opportunities for heterogeneous 3D electronic system integration enabled through novel interconnect structures. Specifically, we focus on the (co)design, fabrication, and characterization of chip-level electrical, optical, and thermal interconnect networks to solve the power delivery, off-chip signaling, and cooling needs of future many-core and memory 3D integrated systems. We also explore the 3D integration of sensor and MEMS devices with CMOS signal processing circuitry.